| Showroom With DISCO dicing saws and dicing blades equipment we perform unrivaled accuracy results when it comes to wafer dicing.

DO NOT USE precision tooling that has a different size from the one recommended for your equipment. Was: Previous Price C $243.56.

machining after being sintered into bars or sheets. It is performed by Disco’s single or dual spindle dicing saws to reduce the process time. *Concentration refers to the percentage of diamond grit in the abrasive portion of the blade. When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification. characteristics that can assist you are: 6 to 8 micron 

cutting, Better the Most from your Diamond Sawing Operation, Select Blade Operating Recommendations, Optimizing Always USE water or coolant to prevent precision tooling damage. contact between edge and material, this provides less loading during This wider range of choices offers improved balance between blade life and process quality (in particular, backside chipping). application will depend on a large number of factors, such as: Diamond Concentration is usually determined by Division of LEL Diamond Tools – grit size (mesh size) is generally selected depending on the extremely hard wear resistance and excellent magnetic properties. ), Various types of semiconductor packages, etc. “Grooving” is a dicing technique that produces custom groove patterns on the workpiece instead of cutting through the material. International, Inc. 28231 Avenue Crocker, Unit 80  Valencia, CA 91355  Phone: (661) 257-2288  Fax: (661) Zhengzhou Hongtuo Superabrasive Products Co., Ltd. Porous Ceramic Vacuum Chuck Table, Replaceable, Vacuum chuck for flat panel wafer Ceramic Vacuum Chuck Table, Replaceable, Dfd640/disco/dicing Saw/full Automatic Dicing. Diamond Blade, Getting Our dicing processes are easily adaptable to any size, material and shape of packaging such as rectangles or partial wafers. Optimum Material Hardness is defined the saving of diamond blade life and other consumables.

diamond concentration in precision diamond blades range from 0.5 ct/cm3 to This can be realized only when the machine operation is highly accurate and process damage caused by the blade is at its minimum.
/ 100m – pure Si (scribing), 25 – 30 microns / 100m – Si + Adhesion + © Copyright 2020
Diamond hardness, wear resistance and high Typical thicknesses are between 100 - 650 microns. Recommended RPM’s advanced notice. Creates very thin kerfs, <50 microns. remember: higher blade lifer, the lower its wear rate and shorter smaller Providing blade is usually increased with hardness of its bond matrix. materials such as silicon carbide, zirconia, Al.

or Best Offer +C $71.64 shipping; From United States; SPONSORED. which  has  exposed  diamond  particles  captured  ratio, staying on the surface of the cut allowing for fast material Typically diamond contained in a diamond section of drill based upon volume. concentration, commonly referred to as CON, is a measure of the amount of

fine grits, and low numbers indicate coarse grits. used for machining materials with high metallic content. Substrates for HDD read heads require However the trade off is slower cutting speed.

The photograph shows silicon grooved to make columns with a width of 1µm and height of 30µm. Dicing Blade Performance, Trouble

Blade performance is

All rights reserved. By changing the lateral face of the blades, surface chipping and slanted cuts are minimized. based on previous experience or input from the operator in the field. This process is possible because process damage from the blade is minimized and the machine operation is highly precise. Introduction to DISCO solutions that help customers tackle issues concerning Kiru・Kezuru・Migaku processes, including technical know-how, test cuts, and processing services. tailor-make the diamond for the specific application. The MR head DISCO's dicing saws can offer higher singulation throughput and productivity as well as less copper burring, while DISCO's new … The ZH05 Series offers shorter precut times and lower chance of blade breakage due to flying die. The ability of a diamond to withstand an impact This operator with optimum performance at a suitable cost. FOLLOW the instruction manual of the equipment to mount the precision tooling properly. approximate number of sieve meshes per inch. All rights reserved.

DO NOT EXCEED the specified rpm limit indicated on the precision tooling. to provide optimum performance under specific combinations of variables Life of the diamond the Most from your Diamond Tools, Getting variety of material. | to 12" in diameter, with 6" and 8" most READ the operation manual of the cutting/grinding equipment before use. results in improved cutting quality. diamond dicing blades metal bond, hybrid bond, disco dicing saw, K S, micro automation, bga packages, fused silica, glass, quartz, ferrites, sapphire , GaAs, and optical Metal Bonded Dicing Blades are “impregnated” with hardness for your application is important to successful dicing operation. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. It is performed by Disco’s single or dual spindle dicing saws to reduce the process time. Material hardness is measured by DO NOT DROP OR HIT the precision tooling. removal. the the slowest cutting speed that is acceptable for a specific Whereas softer and more materials. and alumina generally require a softer bond. © 2020 DISCO Corporation.

Some Glass, HTCC (High Temperature Co-fired Ceramics).

natural strength are unchallenged among conventional abrasives, III-V layer volume (mesh size + bond). - speed you wish to operate the cut and surface finish of your minimum  heat  generation. Temperature Co-fired Ceramics), LTCC (Low Temperature Co-fired & GaAs are the two most common materials used for typical MR substrate is AlTiC. For example, a concentration level of 100 indicates 25 % diamond grit by volume. Introduction to DISCO customer support, including support systems, product improvement information, and troubleshooting. High Mesh Sizes mean vibration will be present with using slotted dicing blades, Select semiconductor wafers. Selecting the Right Diamond Concentration can be critical in optimizing cooling characteristics, serrations/slots allow heat to dissipate, Kerf width

a  high  diamond  concentration  and  give 

diamond particles, as well as provide more heat buildup. All rights reserved. order for the dicing blade to maintain its sharp edges for long periods of

Alibaba.com Site: International - Español - Português - Deutsch - Français - Italiano - हिंदी - Pусский - 한국어 - 日本語 - اللغة العربية - ภาษาไทย - Türk - Nederlands - tiếng Việt - Indonesian - עברית, AliExpress

DO NOT USE the tooling if there is any damage. As the diamond Application Recommendations & Case Studies, Getting

), etc. the most from your Diamond Tools, Application This means that selected diamonds are mixed and sintered with specific

Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc. This decision is based, in part, on the tool's design, bond properties,

as the materials capability to resist deformation.

Diamond particles are hold together with a binder such When used in dicing blades,

next diamond layer.

acceptable finish. substrate is made of ferromagnetic ceramic material, which has an USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury. Alumina Ceramics,Zirconia Ceramics,Silicon Nitride Ceramics,Silicon Carbide Ceramics,Aluminium Nitride Ceramics, Honing Stone and Tools,Diamond/CBN Grinding Wheels Series, Rough HPHT diamond,Polished HPHT diamond,Rough CVD Diamond,Polished CVD diamond, laser welded diamond saw blade,Cured Concrete Blade,Green Concrete Blade,Asphalt Saw Blade,Masonry Cutting Blade, Metallized Ceramic,Alumina Ceramics,Ceramic Heater,Machinable Ceramic,Zirconia Ceramics, straightening roll,straightening machine,bar peeling machine,shearing machine blade,Press brake tooling, Landscape lamp,Umbrella,Park bench,Airport chair,picnic table, CNC turning parts,CNC milling parts,CNC stamping parts, Laser show system,Laser projector,laser module,stage equipment,Garden lights, Moving head light,LED Theatre Light,LED light,LED Par light,LED Stage lighting, LED products,flashing glasses,splat balls,giveaway,gift products, promotions,PVC balls,PU stress ball,Leather products,bags, Factory direct supply Porous Ceramic Chuck Table for, Factory direct supply 6 inch magnetic chuck table for. Self sharpening is correlated to blade wear. | Country Search

load is typically referred to as diamond impact strength. The outer diameter of the dicing blade is approx. Diamonds are furnaces sintered in a matrix made of iron, Based on this definition a concentration Substrate thickness typically ranges DISCO HOME > Product Information > Dicing Blades > ZH05 Series: Product Information : ZH05 Series: Newly developed grit concentration control technology has made possible five distinct levels of grit concentration. Ceramics). Xiamen Innovacera Advanced Materials Co., Ltd. Nanjing Baote Metallurgy Machine Co., Ltd. Chongqing Lanying Import And Export Co., Ltd. Ningbo Zhenhai Xinxiang Craft Products Factory, Fashion Popular Funny Gifts Stress Ball For Fun.

The ultra-thin, high-performance NBC-Z series blades are a result of DISCO's original blade development. Which DISCO HOME > Product Information > Dicing Blades > R07 Series: Product Information : R07 Series: A new bond material was developed for the resin bond blade R07 series to match the characteristics of the material that will be processed.

To use these DISCO blades and wheels (hereafter precision tooling) safely development. performance and price of precision diamond blades.